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 MM3Z2V4ST1 SERIES Zener Voltage Regulators
200 mW SOD-323 Surface Mount Tight Tolerance Portfolio
This series of Zener diodes is packaged in a SOD-323 surface mount package that has a power dissipation of 200 mW. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand-held portables, and high density PC boards.
Specification Features: http://onsemi.com
1 Cathode
2 Anode
* Standard Zener Breakdown Voltage Range - * * * * * * *
2.4 V to 18 V Steady State Power Rating of 200 mW Small Body Outline Dimensions: 0.067 x 0.049 (1.7 mm x 1.25 mm) Low Body Height: 0.035 (0.9 mm) Package Weight: 4.507 mg/unit ESD Rating of Class 3 (>16 kV) per Human Body Model Tight Tolerance VZ Pb-Free Packages are Available
1
2
MARKING DIAGRAM
xx M
SOD-323 CASE 477 STYLE 1
xx = Specific Device Code M = Date Code
ORDERING INFORMATION
Device MM3ZxxxST1 Package SOD-323 SOD-323 SOD-323 (Pb-Free) SOD-323 (Pb-Free) Shipping 3000/Tape & Reel 10,000/Tape & Reel 3000/Tape & Reel 10,000/Tape & Reel
Mechanical Characteristics: CASE: Void-free, transfer-molded plastic FINISH: All external surfaces are corrosion resistant MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
MM3ZxxxST3 MM3ZxxxST1G MM3ZxxxST3G
260C for 10 Seconds LEADS: Plated with Pb-Sn or Sn only (Pb-Free) POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V-0 MOUNTING POSITION: Any
MAXIMUM RATINGS
Rating Total Device Dissipation FR-5 Board, (Note 1) @ TA = 25C Derate above 25C Thermal Resistance from Junction-to-Ambient Junction and Storage Temperature Range Symbol PD 200 1.5 RqJA TJ, Tstg 635 -65 to +150 mW mW/C C/W C Max Unit
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet.
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR-4 Minimum Pad.
(c) Semiconductor Components Industries, LLC, 2004
1
November, 2004 - Rev. 10
Publication Order Number: MM3Z2V4ST1/D
MM3Z2V4ST1 SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol VZ IZT ZZT IZK ZZK IR VR IF VF QVZ C Parameter Reverse Zener Voltage @ IZT Reverse Current Maximum Zener Impedance @ IZT Reverse Current Maximum Zener Impedance @ IZK Reverse Leakage Current @ VR Reverse Voltage Forward Current Forward Voltage @ IF Maximum Temperature Coefficient of VZ Max. Capacitance @VR = 0 and f = 1 MHz VZ VR IR VF IZT V IF I
Zener Voltage Regulator
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
ZZK IZ = 0.5 mA W Max 1000 1000 1000 100 1000 1000 1000 800 500 200 100 160 160 160 160 160 160 80 80 80 80 ZZT IZ = IZT @ 10% Mod W Max 100 100 95 95 90 90 90 80 60 40 10 15 15 15 15 15 15 25 30 40 45 Max IR @ VR mA 120 100 5.0 5.0 5.0 3.0 3.0 3.0 2.0 1.0 3.0 2.0 1.0 0.7 0.5 0.5 0.5 0.1 0.05 0.05 0.05 V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 2.0 4.0 4.0 5.0 5.0 6.0 6.0 7.0 8.0 10.5 11.2 12.6 dVZ/dt (mV/k) @ IZT1 = 5 mA Min -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -2.7 -2.0 0.4 1.2 2.5 3.2 3.8 4.5 5.4 6.0 9.2 10.4 12.4 Max 0 0 0 0 0 -2.5 0 0.2 1.2 2.5 3.7 4.5 5.3 6.2 7.0 8.0 9.0 10 13 14 16
Device MM3Z2V4ST1 MM3Z2V7ST1 MM3Z3V3ST1 MM3Z3V3TT1, G MM3Z3V6ST1, G MM3Z3V9ST1, G MM3Z4V3ST1 MM3Z4V7ST1, G MM3Z5V1ST1 MM3Z5V6ST1 MM3Z6V2ST1 MM3Z6V8ST1 MM3Z7V5ST1 MM3Z8V2ST1 MM3Z9V1ST1 MM3Z10VST1 MM3Z11VST1 MM3Z12VST1 MM3Z15VST1* MM3Z16VST1 MM3Z18VST1
Device Marking T2 T3 T5 TX T6 T7 T8 T9 TA TC TE TF TG TH TK WB WC TN WF TU TW
Test Current Izt mA 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0
Zener Voltage VZ Min 2.43 2.67 3.32 3.19 3.60 3.89 4.17 4.55 4.98 5.49 6.06 6.65 7.28 8.02 8.85 9.80 10.78 11.74 14.7 15.85 17.56 Max 2.63 2.91 3.53 3.41 3.85 4.16 4.43 4.75 5.2 5.73 6.33 6.93 7.6 8.36 9.23 10.20 11.22 12.24 15.3 16.51 18.35
C pF Max @ VR = 0 f = 1 MHz 450 450 450 450 450 450 450 260 225 200 185 155 140 1358 130 130 130 130 110 105 100
*Product preview - parts available upon request.
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2
MM3Z2V4ST1 SERIES
Typical Characteristics
1000 Z ZT , DYNAMIC IMPEDANCE ( ) TJ = 25C IZ(AC) = 0.1 IZ(DC) f = 1 kHz 1000 IF, FORWARD CURRENT (mA)
100
100
IZ = 1 mA 10 5 mA
10
150C
75C 1.0 3.0 VZ, NOMINAL ZENER VOLTAGE 10 0.4 0.5
25C
0C 1.1 1.2
1.0
0.6 0.7 0.8 0.9 1.0 VF, FORWARD VOLTAGE (V)
Figure 1. Effect of Zener Voltage on Zener Impedance
1000 IR, LEAKAGE CURRENT ( A) TA = 25C C, CAPACITANCE (pF) 0 V BIAS 1 V BIAS 1000 100 10 1.0 0.1 0.01
Figure 2. Typical Forward Voltage
100 BIAS AT 50% OF VZ NOM 10
+150C
0.001
+ 25C -55C 0 5.0 VZ, NOMINAL ZENER VOLTAGE (V) 10
0.0001 1.0 4.0 VZ, NOMINAL ZENER VOLTAGE (V) 10 0.00001
Figure 3. Typical Capacitance
Figure 4. Typical Leakage Current
100 TA = 25C I Z , ZENER CURRENT (mA)
100
80 POWER DISSIPATION (%) 0 2.0 4.0 6.0 VZ, ZENER VOLTAGE (V) 8.0 10 10
60
1.0
40
0.1
20 0
0.01
0
25
50 75 100 TEMPERATURE (C)
125
150
Figure 5. Zener Voltage versus Zener Current (VZ Up to 9 V)
Figure 6. Steady State Power Derating
http://onsemi.com
3
MM3Z2V4ST1 SERIES
PACKAGE DIMENSIONS
SOD-323 CASE 477-02 ISSUE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. DIM A B C D E H J K L MILLIMETERS MIN MAX 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 0.15 REF 0.00 0.10 0.089 0.177 2.30 2.70 0.075 --- INCHES MIN MAX 0.063 0.071 0.045 0.053 0.031 0.039 0.010 0.016 0.006 REF 0.000 0.004 0.0035 0.0070 0.091 0.106 0.003 ---
K A
D
1
2
B
E C L
NOTE 5
J
NOTE 3
H
STYLE 1: PIN 1. CATHODE 2. ANODE
SOLDERING FOOTPRINT*
0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112
SCALE 10:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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4
MM3Z2V4ST1/D


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